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For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

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For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

Brand Name : HRT

Model Number : A1500H-NP-HRT

Certification : ISO9001/ ISO14001/UL/RoHS/REACH

Place of Origin : Dongguan, China(mainland)

MOQ : 5000 pcs

Price : Negotiated

Payment Terms : TT, Western Union, PayPal, L/C

Supply Ability : 28 million pcs per month

Delivery Time : 5 to 8 working days after payment checked

Packaging Details : Bag with outside carton

Category : Crimp Housings

Application : Signal, Wire-to-Board

Material : PA66

Flammability : UL94V-0

Wire range : AWG26# to 32#

Gender : female

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1.25mm Pitch Circuit Board Wire Connectors With Lock Structure PA66 / LCP Material

1, The specification of the product including basic size information, electrical and mechanical properties.

Basic size information
Suitable terminals A1500T series
Suitable wafer A1500WR/WV series
Pitch 1.50mm
Color white
Row single
Lock to mating part without
Circuits 2 to 14
Wire insulation diameter 1.15mm Max.
Terminal materials phosphor bronze, tin-plated
Electrical properties
Current Rating 1A AC, DC
Voltage Rating 125V AC, DC
Contact Resistance 20mΩ Max
Insulation Resistance 100mΩ min
Withstanding Voltage 500V AC/minute
Mechanical properties
Temperature range -25℃ to 85 ℃
Other information please kindly check the following picture.

2, Related drawing and report

Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.

For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

Revision Control

Rev. ECN Number Originator Checked Approval Issue Date
B/0 New Release Marike Deng Kevin Chen Jacky Qi 06/20/2010

Product Summary Test Report Origination

Originator by Date Checked by Date Approved by Date
Marike Deng 06/20/10’ Kevin Chen 06/20/10’ Jacky Qi 06/25/10’

This document is the property of Xin Pei Enterprise and delivered on the express condition that it is not be disclosed, reproduced or used, in whole or in part, for manufacture or sale by anyone other than Xin Pei Enterprise.

Without its prior consent, and that no right is granted to disclose or to use any information in this document.

1. Scope

This specification covers the requirements for product performance of 1.50mm pitch wire to board

connectors series.

2. Construction,Dimensions,Material & Plating

See the attached drawings

3. Ratings & Applicable Wires

Item Standard
Rated Voltage (Max.) 100V AC/DC Insulation O.D. 1.10mm (Max.)
Rated Current (Max.) And Applicable Wires AWG#26 1A AC/DC
AWG#28 1A AC/DC
AWG#30 1A AC/DC
AWG#32 0.8A AC/DC
Ambient Temperature Range -25℃ ~ +85℃*

*: Including terminal temperature rise

4. Electrical Performance

Test Description Procedure Requirement
4-1

Contact Resistance

 Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4) 20mΩ (Max.)
4-2 Insulation Resistance Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B) 500MΩ (Min.)
4-3 Dielectric Withstanding Voltage Mate connectors, apply 500V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301) No Breakdown.
4-4 Contact Resistance on Crimped Portion Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA. 5mΩ (Max.)

5. Mechanical Performance

Test Description Procedure Requirement
5-1 Actuator Insertion & Withdrawal Force Insert and withdraw connectors at the speed rate of 25±3mm / minute. Refer to paragraph 7
5-2 Crimping Pull Out Force Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) AWG#26 2.0kgf (Min)
AWG#28 1.0kgf (Min)
AWG#30 0.8kgf (Min)
AWG#32 0.5kgf (Min)
5-3 Terminal Insertion Force. Insert the crimped terminal into the housing. 1.00kgf (Max.)
5-4 Terminal/Housing Retention Force. Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing. 1.00kgf (Min.)
5-5 Pin Retention Force Apply axial push force at the speed rate of 25±3mm / minute 0.70kgf (Min.)
5-6 Durability When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute. Contact Resistance 40mΩ (Max.)
5-7 Vibration

Amplitude: 1.5mm P-P

Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

(Based upon MIL-STD-202 Method 201A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Discontinuity 1 μsec.(Max.)
5-8 Physical Shock 490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description Procedure Requirement
6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)
6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
6-4 Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Insulation Resistance 50MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3
6-5 Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)
6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7 SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.
6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

6-9 Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

 Solder Wetting 95% of immersed area must show no voids, pin holes
6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

 Appearance No Damage.
6-11 Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

 Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits At Initial
Insertion (Max.) Withdrawal (Min.)
Single 0.70 0.06
02 2.50 0.40
03 3.00 0.50
04 3.50 0.60
05 4.00 0.70
06 4.50 0.80
07 5.00 0.80
08 5.50 0.90
09 6.00 0.90
10 6.50 1.00
11 7.00 1.00
12 7.50 1.20
13 8.00 1.20


3, HRT main product show

You can get more series parts from the below picture, it's our main product picture from our different type.


Product Tags:

Connector Wire To Board

      

Board To Wire Connectors

      
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